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lee  ->Other Chips (62)
02091(2007/10/12)
Part No:  
21-43721-01
  
Package:  
PQFP+SLOT
M.F.G.:  
DEC
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
COMPAQ小型机的CPU 21-43721-01 2KA830DYVY0 (4-1)
02093(2007/10/12)
Part No:  
21-43721-02
  
Package:  
PQFP+SLOT
M.F.G.:  
DEC
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
COMPAQ小型机的CPU 21-43721-01 6KA830D8N12 (4-3)
02094(2007/10/12)
Part No:  
21-43722-01
 
Package:  
PQFP+SLOT
M.F.G.:  
DEC
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
COMPAQ小型机的CPU 21-43721-01 8KA831DVW86 (4-4)
02092(2007/10/12)
Part No:  
21-43722-01
 
Package:  
PQFP+SLOT
M.F.G.:  
DEC
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
COMPAQ小型机的CPU 21-43721-01 4KA829C8K44 (4-2)
02129(2007/11/6)
Part No:  
21-43918-23 466MHz
 
Package:  
PGA+SLOT
M.F.G.:  
DEC
Class:  
Other Chips
Owner:  
lee
MfgDate:  
9735
Comments:  
KA829CNA64 DEC 1026J H 9735 21-43918-23 466MHz 21164 4M Cache B3105-CA
02127(2007/11/6)
Part No:  
21-43918-45 533MHz
 
Package:  
PGA+SLOT
M.F.G.:  
DEC
Class:  
Other Chips
Owner:  
lee
MfgDate:  
9735
Comments:  
KA829CNA68 DEC 1026J H 9735 21-43918-45 533MHz 21164 4M Cache B3105-CA
02126(2007/11/6)
Part No:  
21-43918-45 533MHz
 
Package:  
PGA+SLOT
M.F.G.:  
DEC
Class:  
Other Chips
Owner:  
lee
MfgDate:  
9735
Comments:  
KA829CNA55 DEC 1026J H 9735 21-43918-45 533MHz 21164 4M Cache B3105-CA
02128(2007/11/6)
Part No:  
21-43918-45 533MHz
 
Package:  
PGA+SLOT
M.F.G.:  
DEC
Class:  
Other Chips
Owner:  
lee
MfgDate:  
9735
Comments:  
KA829CNA85 DEC 1026J H 9735 21-43918-45 533MHz 21164 4M Cache B3105-CA
02162(2007/11/29)
Part No:  
51-W6280B02
  
Package:  
PGA
M.F.G.:  
Motorola
Class:  
Other Chips
Owner:  
lee
MfgDate:  
9838
Comments:  
MOTOROLA 51-W6280B02 16H7Y0005 JAPAN 98381EAI
02185(2007/12/1)
Part No:  
A3262-00084
  
Package:  
PGA+SLOT
M.F.G.:  
HP
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
A3262-00084 （6-6 B）
02186(2007/12/1)
Part No:  
A3262-00084
  
Package:  
PGA+SLOT
M.F.G.:  
HP
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
A3262-00084 （6-6 C）
02187(2007/12/1)
Part No:  
A3262-00084
  
Package:  
PGA+SLOT
M.F.G.:  
HP
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
这是主图，前四张图在风扇和散热器下。 （6-6 A）
01542(2007/6/23)
Part No:  
APPLE
  
Package:  
BGA>SLOT
M.F.G.:  
Motorola
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
01540(2007/6/23)
Part No:  
APPLE
 
Package:  
BGA+PQFP>PGA
M.F.G.:  
Motorola
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
01539(2007/6/23)
Part No:  
APPLE
  
Package:  
BGA+PQFP>PGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
01541(2007/6/23)
Part No:  
APPLE 双核
  
Package:  
BGA>SLOT
M.F.G.:  
Motorola
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
02193(2007/12/18)
Part No:  
B50422-18
  
Package:  
PGA+SLOT
M.F.G.:  
DEC
Class:  
Other Chips
Owner:  
lee
MfgDate:  
1993
Comments:  
DIGITAL EQUIPMENT CORP 54-23297-03 KA520AADNN (M) (C) DEC H2 9515 444E9 DEC 284J H 9505 21064-AB-A200 21-40532-02 KKA E45L
01944(2007/10/6)
Part No:  
C82586
  
Package:  
CDIP
M.F.G.:  
Intel
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
C82586 S52234 L9470828 INTEL (10-1-5)
01945(2007/10/6)
Part No:  
C82586
  
Package:  
CDIP
M.F.G.:  
Intel
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
C82586 S52234 L9470828 INTEL (10-2-5)
01708(2007/6/27)
Part No:  
c8275086 985d
  
Package:  
LGA
M.F.G.:  
Sun
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
01768(2007/7/2)
Part No:  
CX-83D87-33-GP
  
Package:  
PGA
M.F.G.:  
Cyrix
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
02142(2007/11/16)
Part No:  
D3031DR-40
  
Package:  
PGA
M.F.G.:  
NEC
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
NEC JAPAN D30331DR-40 VR30000A-40 9142E9 CPU
01943(2007/10/6)
Part No:  
D7220AD
  
Package:  
CDIP
M.F.G.:  
NEC
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
02295(2008/5/3)
Part No:  
DC1084E
  
Package:  
BGA
M.F.G.:  
DEC
Class:  
Other Chips
Owner:  
lee
MfgDate:  
9931
Comments:  
02299(2008/5/3)
Part No:  
DC1106A
  
Package:  
BGA
M.F.G.:  
DEC
Class:  
Other Chips
Owner:  
lee
MfgDate:  
9939
Comments:  
02298(2008/5/3)
Part No:  
DC1118A
  
Package:  
BGA
M.F.G.:  
DEC
Class:  
Other Chips
Owner:  
lee
MfgDate:  
9916
Comments:  
02296(2008/5/3)
Part No:  
DC1118A
  
Package:  
BGA
M.F.G.:  
DEC
Class:  
Other Chips
Owner:  
lee
MfgDate:  
9916
Comments:  
02297(2008/5/3)
Part No:  
DC1118A
  
Package:  
BGA
M.F.G.:  
DEC
Class:  
Other Chips
Owner:  
lee
MfgDate:  
9916
Comments:  
01724(2007/6/27)
Part No:  
DLP
  
Package:  
CERQUAD
M.F.G.:  
Texas Instruments
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
陶瓷封装,有玻璃窗.内部引线,一清二楚.
02082(2007/10/12)
Part No:  
GXM-366
  
Package:  
PGA
M.F.G.:  
AMD
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
01731(2007/7/1)
Part No:  
HT354XS-B
  
Package:  
pga
M.F.G.:  
LSI
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
HYDRA CCU
01885(2007/9/14)
Part No:  
IBM 9314 63F7695ESD
  
Package:  
P-PGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
IBM 9314PQ 63F7695ESD 19319000SQ IBM小型机 1-1 引脚排列与众不同!
01884(2007/9/14)
Part No:  
IBM 9314 63F8963
  
Package:  
c-pga
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
IBM 9314 63F8963 9323 1400 IBM小型机 1-1
01896(2007/9/14)
Part No:  
IBM 9314PQ 33G0564ESD
  
Package:  
C-PGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
IBM 9314PQ 33G0564ESD 19316000HI IBM小型机CPU 6-5
01895(2007/9/14)
Part No:  
IBM 9314PQ 33G0567ESD
  
Package:  
C-PGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
IBM 9314PQ 33G0567ESD 19319000HJ IBM小型机CPU 6-4 编号又相同了!!
01894(2007/9/14)
Part No:  
IBM 9314PQ 33G0567ESD
  
Package:  
C-PGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
IBM 9314PQ 33G0567ESD 19319000HJ IBM小型机CPU 6-3
01897(2007/9/14)
Part No:  
IBM 9314PQ 50G5730ESD
  
Package:  
C-PGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
IBM 9314PQ 50G5730ESD 19315000HA IBM小型机CPU 6-6
01893(2007/9/14)
Part No:  
IBM 9314PQ 50G5733ESD
 
Package:  
C-PGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
IBM 9314PQ 50G5733ESD 19315000SI IBM小型机CPU 6-2
01892(2007/9/14)
Part No:  
IBM 9314PQ 50G5736ESD
  
Package:  
C-PGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
IBM 9314PQ 50G5736ESD 19317000SJ IBM小型机CPU 6-1
01887(2007/9/14)
Part No:  
IBM 9314PQ 63F7862ESD
 
Package:  
P-PGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
IBM 9314PQ 63F7862ESD 19148003YW IBM小型机 2-2 编号完全相同?!
01886(2007/9/14)
Part No:  
IBM 9314PQ 63F7862ESD
  
Package:  
P-PGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
IBM 9314PQ 63F7862ESD 19148003YW IBM小型机 2-1 编号完全相同?
01888(2007/9/14)
Part No:  
IBM 9314PQ 82F6767ESD
  
Package:  
P-PGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
IBM 9314PQ 82F6767ESD 19141002GKIBM IBM小型机 1-1
01891(2007/9/14)
Part No:  
IBM 9314PQ QQG3584
  
Package:  
PQFP
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
IBM 9314PQ QQG3584 1M17002EJ PQFP封装的IBM小型机CPU
02181(2007/12/1)
Part No:  
IDT 79R4700-100G
  
Package:  
PGA
M.F.G.:  
IDT
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
IDT 79R4700-100G KE （6-4）
02182(2007/12/1)
Part No:  
IDT 79R4700-100G
  
Package:  
PGA
M.F.G.:  
IDT
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
IDT 79R4700-100G KN （6-3）
02183(2007/12/1)
Part No:  
IDT 79R4700-100G
  
Package:  
PGA
M.F.G.:  
IDT
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
IDT 79R4700-100G HI （6-5）
02180(2007/12/1)
Part No:  
IDT 79R4700-100G
  
Package:  
PGA
M.F.G.:  
IDT
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
IDT 79R4700-100G HV （6-2）
02184(2007/12/1)
Part No:  
IDT 79R4700-100G
  
Package:  
PGA
M.F.G.:  
IDT
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
IDT 79R4700-100G HD （6-1）
02081(2007/10/12)
Part No:  
IDT-C6-200
  
Package:  
PGA
M.F.G.:  
IDT
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
02289(2008/5/3)
Part No:  
JQ 750
  
Package:  
BGA+PGA+PQFP
M.F.G.:  
Motorola
Class:  
Other Chips
Owner:  
lee
MfgDate:  
Comments:  
APPLE G3 CPU
   
    Record in the Pag ,Total Page:2 ,CurrentPage:1  

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